An injection molding apparatus for injection molding a component includes a first mold half, a second mold half, an eject pin, a receiving container and a blocking device. The second mold half is placed opposite to the first mold half. The eject pin penetrates through the first mold half. The receiving container is placed below the first mold half and the second half. The receiving container is configured for receiving the molding component. The blocking device is movable relative to the first mold half to face toward the first mold half. The blocking device is configured for blocking the molding component when the eject pin ejects the component out from the first mold half.