Invention Grant
- Patent Title: Method of fabricating sealing substrate
- Patent Title (中): 密封基板的制造方法
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Application No.: US11907086Application Date: 2007-10-09
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Publication No.: US07662007B2Publication Date: 2010-02-16
- Inventor: Kenji Hayashi
- Applicant: Kenji Hayashi
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2002-12884 20020122
- Main IPC: H01J9/24
- IPC: H01J9/24
Abstract:
A sealing substrate has first and second substrates. A hollow portion is formed in a first surface of the first substrate. The first substrate has a plate portion that forms a bottom surface of a hollow portion and a frame portion that forms an inner wall surface of the hollow portion. The second substrate is affixed to a second surface of the first substrate. The second substrate is formed of a material having a lower specific gravity than that of the first substrate.
Public/Granted literature
- US20080045111A1 Sealing substrate, method of fabricating the same, display device and electronic instrument Public/Granted day:2008-02-21
Information query
