Invention Grant
- Patent Title: Manufacturing method of thin keypad assembly
- Patent Title (中): 薄键盘组件的制造方法
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Application No.: US11741897Application Date: 2007-04-30
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Publication No.: US07662327B2Publication Date: 2010-02-16
- Inventor: Chih-Ho Hsu
- Applicant: Chih-Ho Hsu
- Applicant Address: TW Taoyuan
- Assignee: Ichia Technologies, Inc.
- Current Assignee: Ichia Technologies, Inc.
- Current Assignee Address: TW Taoyuan
- Agent Chun-Ming Shih
- Priority: TW96108815A 20070314
- Main IPC: B29C39/12
- IPC: B29C39/12

Abstract:
In a method of manufacturing a thin keypad of a keypad panel having a smooth surface, a mist surface or a lines layer, the method includes the steps of: preparing a mold with an internal bottom surface of a coarse surface, a smooth surface or a lines surface; applying an adhesive into the mold and coating a carrier onto the surface of the adhesive; rolling the surface of the carrier by a roller to level the adhesive in the mold; performing a ultraviolet projection to cure the adhesive to form a keypad layer on the carrier; filming a ground color layer, a function color layer and a font color layer sequentially on the carrier as the background of the keypad panel; and hot pressing and combining the keypad layer and silicon to produce the keypad panel.
Public/Granted literature
- US20080224359A1 MANUFACTURING METHOD OF THIN KEYPAD ASSEMBLY Public/Granted day:2008-09-18
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