Invention Grant
US07662327B2 Manufacturing method of thin keypad assembly 失效
薄键盘组件的制造方法

  • Patent Title: Manufacturing method of thin keypad assembly
  • Patent Title (中): 薄键盘组件的制造方法
  • Application No.: US11741897
    Application Date: 2007-04-30
  • Publication No.: US07662327B2
    Publication Date: 2010-02-16
  • Inventor: Chih-Ho Hsu
  • Applicant: Chih-Ho Hsu
  • Applicant Address: TW Taoyuan
  • Assignee: Ichia Technologies, Inc.
  • Current Assignee: Ichia Technologies, Inc.
  • Current Assignee Address: TW Taoyuan
  • Agent Chun-Ming Shih
  • Priority: TW96108815A 20070314
  • Main IPC: B29C39/12
  • IPC: B29C39/12
Manufacturing method of thin keypad assembly
Abstract:
In a method of manufacturing a thin keypad of a keypad panel having a smooth surface, a mist surface or a lines layer, the method includes the steps of: preparing a mold with an internal bottom surface of a coarse surface, a smooth surface or a lines surface; applying an adhesive into the mold and coating a carrier onto the surface of the adhesive; rolling the surface of the carrier by a roller to level the adhesive in the mold; performing a ultraviolet projection to cure the adhesive to form a keypad layer on the carrier; filming a ground color layer, a function color layer and a font color layer sequentially on the carrier as the background of the keypad panel; and hot pressing and combining the keypad layer and silicon to produce the keypad panel.
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