Invention Grant
- Patent Title: Laminate comprising polyimide and conductor layer, multi-layer wiring board with the use of the same and process for producing the same
- Patent Title (中): 包含聚酰亚胺和导体层的层压板，使用其的多层布线板及其制造方法
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Application No.: US09782169Application Date: 2001-02-14
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Publication No.: US07662429B2Publication Date: 2010-02-16
- Inventor: Shoji Hara , Takashi Itoh , Hitoshi Nojiri , Masaru Nishinaka
- Applicant: Shoji Hara , Takashi Itoh , Hitoshi Nojiri , Masaru Nishinaka
- Applicant Address: JP Osaka
- Assignee: Kaneka Corporation
- Current Assignee: Kaneka Corporation
- Current Assignee Address: JP Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2000-034853 20000214; JP2000-235130 20000803
- Main IPC: B05D5/12
- IPC: B05D5/12 ; C23C14/00
Abstract:
A laminate comprising a polyimide and a conductor layer, which is obtained by forming at least one conductor layer directly on the surface of a thermoplastic polyimide, is thermally fused by pressurizing and heating to thereby enhance the adhesion strength between the thermoplastic polyimide and the conductor layer. Thus, a laminate having an excellent adhesion strength between a conductor layer and a polyimide film can be obtained without performing any surface roughening treatment or using any adhesive metal layer.
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