Invention Grant
- Patent Title: Adhesion promoter
- Patent Title (中): 粘合促进剂
-
Application No.: US11217243Application Date: 2005-09-01
-
Publication No.: US07662482B2Publication Date: 2010-02-16
- Inventor: Yee Yang Wang , Barbara J. Walter
- Applicant: Yee Yang Wang , Barbara J. Walter
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies, Inc.
- Current Assignee: Dow Global Technologies, Inc.
- Current Assignee Address: US MI Midland
- Agency: Dobrusin & Thennisch PC
- Main IPC: B32B27/00
- IPC: B32B27/00 ; B32B27/30 ; C08F265/00 ; B32B7/12 ; C09J163/00 ; C07C69/10

Abstract:
The present invention provides an improved bonding system including an adhesion promoter that may be used to help adhesively bond two or more components together. The preferred use of the present adhesion promoter is in a transportation vehicle (e.g., automobile), and more particularly in an engine assembly for use in such vehicles. The present invention includes a bonded automobile engine assembly including at least one plastic component, an adhesive that bonds the plastic component to at least one separate component, and an adhesion promoter between the adhesive and the plastic component. Fasteners for attaching components are optionally employed. In one specific example, an intake manifold including a plastic component is bonded to an engine assembly.
Public/Granted literature
- US20060051605A1 Adhesion promoter Public/Granted day:2006-03-09
Information query