Invention Grant
- Patent Title: Photosensitive resin composition and photosensitive dry film by the use thereof
- Patent Title (中): 感光树脂组合物和感光性干膜的使用
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Application No.: US11667888Application Date: 2005-11-22
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Publication No.: US07662541B2Publication Date: 2010-02-16
- Inventor: Teruhiro Uematsu , Naoya Katsumata
- Applicant: Teruhiro Uematsu , Naoya Katsumata
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2004-340886 20041125
- International Application: PCT/JP2005/021939 WO 20051122
- International Announcement: WO2006/057423 WO 20060601
- Main IPC: G03F7/031
- IPC: G03F7/031

Abstract:
A photosensitive resin composition and a photosensitive dry film which are excellent in both sensitivity and stability and are well-balanced in tent strength, resolution and plating non-staining are provided. The photosensitive resin composition comprises an alkali-soluble resin (A), a photopolymerizable compound (B) and a photopolymerization initiator (C), and the polymerization initiator (C) comprises a hexaarylbisimidazole based compound (C1) and a multifunctional thiol compound (C2) as essential components. The photosensitive dry film has at least a photosensitive resin layer formed from the photosensitive resin composition on a support film.
Public/Granted literature
- US20070292804A1 Photosensitive Resin Composition and Photosensitive Dry Film by the Use Thereof Public/Granted day:2007-12-20
Information query
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