Invention Grant
US07662646B2 Plasma processing method and plasma processing apparatus for performing accurate end point detection
有权
用于执行精确终点检测的等离子体处理方法和等离子体处理装置
- Patent Title: Plasma processing method and plasma processing apparatus for performing accurate end point detection
- Patent Title (中): 用于执行精确终点检测的等离子体处理方法和等离子体处理装置
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Application No.: US11687428Application Date: 2007-03-16
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Publication No.: US07662646B2Publication Date: 2010-02-16
- Inventor: Kosuke Ogasawara , Susumu Saito , Syuji Nozawa
- Applicant: Kosuke Ogasawara , Susumu Saito , Syuji Nozawa
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-075308 20060317
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
In a plasma processing method, a correlation between substrate type data and optical data is obtained by using a multivariate analysis; substrate type data is obtained from optical data based on the correlation when initiating a plasma processing; and a substrate type is determined by using the obtained substrate type data. Further, a setting data set corresponding to the determined substrate type is selected from setting data sets, each for detecting a plasma processing end point of the plasma processing, each of the setting data sets being stored in advance in a data storage unit; an end point of the plasma processing is detected based on the selected setting data set; and the plasma processing is terminated at the detected end point.
Public/Granted literature
- US20080070327A1 PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS Public/Granted day:2008-03-20
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