Invention Grant
- Patent Title: Method of manufacturing a substrate structure for increasing cutting precision and strength thereof
- Patent Title (中): 制造提高切割精度和强度的基板结构的方法
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Application No.: US11304558Application Date: 2005-12-16
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Publication No.: US07662661B2Publication Date: 2010-02-16
- Inventor: Bily Wang , Jonnie Chuang , Hui-Yen Huang
- Applicant: Bily Wang , Jonnie Chuang , Hui-Yen Huang
- Applicant Address: TW Hsin Chu
- Assignee: Harvatek Corporation
- Current Assignee: Harvatek Corporation
- Current Assignee Address: TW Hsin Chu
- Agency: Rosenberg, Klein & Lee
- Main IPC: H01L21/66
- IPC: H01L21/66 ; G01R31/26 ; H01L21/00 ; H01L21/50 ; H01L21/48 ; H01L21/44
Abstract:
A method of manufacturing a substrate structure includes the steps of: (1) providing a metal substrate having a metal portion; (2) chemically etching a plurality of trenches in the metal substrate; (3) applying a polymer composite material into the trenches to form a substrate having a polymer composite portion abutted to the metal portion; (4) polishing a surface of the substrate to make a height of the polymer composite portion equal to that of the metal portion; (5) forming a covering material on the surface of the substrate; and (6) cutting the substrate via the polymer composite portion for decreasing cutting bur produced on the metal portion. Furthermore, the method is provided for combining the metal substrate and the polymer composite material, thereby to increase cutting precision and strength of the substrate structure.
Public/Granted literature
- US20060099728A1 Method of manufacturing a substrate structure for increasing cutting precision and strength thereof Public/Granted day:2006-05-11
Information query
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