Invention Grant
- Patent Title: Method for separating a semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate
- Patent Title (中): 将半导体衬底与半导体衬底上的切割线分离成多个芯片的方法
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Application No.: US11591496Application Date: 2006-11-02
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Publication No.: US07662668B2Publication Date: 2010-02-16
- Inventor: Kazuhiko Sugiura , Kenichi Yokoyama , Muneo Tamura , Tetsuo Fujii , Makoto Asai
- Applicant: Kazuhiko Sugiura , Kenichi Yokoyama , Muneo Tamura , Tetsuo Fujii , Makoto Asai
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2005-331214 20051116; JP2005-331215 20051116; JP2005-331216 20051116
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A separating device for separating a semiconductor substrate includes: a cutting element for cutting the semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate; an adsorbing element for adsorbing a dust on a surface of the semiconductor substrate by using electrostatic force; and a static electricity generating element for generating static electricity and for controlling the static electricity in order to remove the dust from the adsorbing element.
Public/Granted literature
- US20070111476A1 Separating device for separating semiconductor substrate and method for separating the same Public/Granted day:2007-05-17
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