Invention Grant
- Patent Title: Method of producing a semiconductor element in a substrate and a semiconductor element
- Patent Title (中): 在衬底和半导体元件中制造半导体元件的方法
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Application No.: US11864517Application Date: 2007-09-28
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Publication No.: US07662680B2Publication Date: 2010-02-16
- Inventor: Luis-Felipe Giles
- Applicant: Luis-Felipe Giles
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method of producing a semiconductor element in a substrate includes forming a plurality of micro-cavities and carbide precipitates in the substrate, creating an amorphization of the substrate to form crystallographic defects and a doping of the substrate with doping atoms, annealing the substrate such that at least a part of the crystallographic defects are eliminated using the micro-cavities and the carbide precipitates, and wherein the semiconductor element is formed using the doping atoms.
Public/Granted literature
- US20090085035A1 Method of Producing a Semiconductor Element in a Substrate and a Semiconductor Element Public/Granted day:2009-04-02
Information query
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