Invention Grant
US07662691B2 Method for fabricating semiconductor device with epitaxial growth
失效
用于制造具有外延生长的半导体器件的方法
- Patent Title: Method for fabricating semiconductor device with epitaxial growth
- Patent Title (中): 用于制造具有外延生长的半导体器件的方法
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Application No.: US11872023Application Date: 2007-10-14
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Publication No.: US07662691B2Publication Date: 2010-02-16
- Inventor: Su Ock Chung
- Applicant: Su Ock Chung
- Applicant Address: KR Icheon-si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-si
- Agency: Townsend and Townsend and Crew LLP
- Priority: KR10-2007-0050788 20070525
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device comprises an active region including a first active area to be a source/drain and a second active area to be a gate, and a device isolation region defining the active region. The first active area is obtained by growing a semiconductor substrate located between the gates as a seed layer, and formed to have a larger line-width than that of the second active area in a longitudinal direction of the gate.
Public/Granted literature
- US20080290402A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2008-11-27
Information query
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