Invention Grant
- Patent Title: Capacitor structure and fabricating method thereof
- Patent Title (中): 电容器结构及其制造方法
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Application No.: US12149795Application Date: 2008-05-08
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Publication No.: US07662695B2Publication Date: 2010-02-16
- Inventor: Chee Hong Choi
- Applicant: Chee Hong Choi
- Applicant Address: KR Seoul
- Assignee: Dongbu Electronics Co. Ltd.
- Current Assignee: Dongbu Electronics Co. Ltd.
- Current Assignee Address: KR Seoul
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: KR10-2004-0114797 20041229
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
Disclosed are a vertical-type capacitor and a formation method thereof. The capacitor includes a first electrode wall and a second electrode wall perpendicular to a semiconductor substrate, and at least one dielectric layer on the substrate to insulate the first electrode wall from the second electrode wall. The first electrode wall includes a plurality of first conductive layers and a plurality of first contacts, the plurality of first conductive layers being interconnected with each other by each of the plurality of first contacts. The second electrode wall includes a plurality of second conductive layers and a plurality of second contacts, the plurality of second conductive layers being interconnected with each other by each of the plurality of second contacts.
Public/Granted literature
- US20080213958A1 Capacitor structure and fabricating method thereof Public/Granted day:2008-09-04
Information query
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