Invention Grant
- Patent Title: Self-assembled interconnection particles
- Patent Title (中): 自组装互连颗粒
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Application No.: US11191435Application Date: 2005-07-27
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Publication No.: US07662708B2Publication Date: 2010-02-16
- Inventor: David K. Fork , Thomas Hantschel , Michael L. Chabinyc
- Applicant: David K. Fork , Thomas Hantschel , Michael L. Chabinyc
- Applicant Address: US CA Palo Alto
- Assignee: Palo Alto Research Center Incorporated
- Current Assignee: Palo Alto Research Center Incorporated
- Current Assignee Address: US CA Palo Alto
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.
Public/Granted literature
- US20070023907A1 Self-assembled interconnection particles Public/Granted day:2007-02-01
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