Invention Grant
US07662762B2 Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates
有权
包含用于清洁半导体衬底上的无机残留物的铜特异性腐蚀抑制剂的水性清洁组合物
- Patent Title: Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrates
- Patent Title (中): 包含用于清洁半导体衬底上的无机残留物的铜特异性腐蚀抑制剂的水性清洁组合物
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Application No.: US11042531Application Date: 2005-01-24
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Publication No.: US07662762B2Publication Date: 2010-02-16
- Inventor: William A. Wojtczak , Ma. Fatima Seijo , David Bernhard , Long Nguyen
- Applicant: William A. Wojtczak , Ma. Fatima Seijo , David Bernhard , Long Nguyen
- Applicant Address: US CT Danbury
- Assignee: Advanced Technology Materials, Inc.
- Current Assignee: Advanced Technology Materials, Inc.
- Current Assignee Address: US CT Danbury
- Agency: Moore & Van Allen, PLLC
- Agent Tristan A. Fuierer; Chih-Sheng Lin
- Main IPC: C11D7/32
- IPC: C11D7/32
Abstract:
A semiconductor wafer cleaning formulation, including 1-21% wt. fluoride source, 20-55% wt. organic amine(s), 0.5-40% wt. nitrogenous component, e.g., a nitrogen-containing carboxylic acid or an imine, 23-50% wt. water, and 0-21% wt. metal chelating agent(s). The formulations are useful to remove residue from wafers following a resist plasma ashing step, such as inorganic residue from semiconductor wafers containing delicate copper interconnecting structures.
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