Invention Grant
- Patent Title: Circuit board with improved ground plane
- Patent Title (中): 电路板具有改进的接地平面
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Application No.: US11737147Application Date: 2007-04-19
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Publication No.: US07663063B2Publication Date: 2010-02-16
- Inventor: Yu-Hsu Lin , Jeng-Da Wu , Chih-Hang Chao
- Applicant: Yu-Hsu Lin , Jeng-Da Wu , Chih-Hang Chao
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200610157882 20061222
- Main IPC: H05K1/03
- IPC: H05K1/03

Abstract:
A circuit board is provided for improving signal quality, including a signal plane for a plurality of signal traces arranged thereon and a ground plane formed by a plurality of tiles connected to each other in an array. Each tile is formed by ground traces. Different line segments of a signal trace mapped on the ground plane cross ground traces of the tiles at similar angles, thereby minimizing interaction between the ground traces and the signal traces to reduce differences in impedances of the signal traces.
Public/Granted literature
- US20080151521A1 CIRCUIT BOARD WITH IMPROVED GROUND PLANE Public/Granted day:2008-06-26
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