Invention Grant
- Patent Title: SyAF structure to fabricate Mbit MTJ MRAM
- Patent Title (中): SyAF结构制造Mbit MTJ MRAM
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Application No.: US11715728Application Date: 2007-03-08
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Publication No.: US07663131B2Publication Date: 2010-02-16
- Inventor: Cheng T. Horng , Ru-Ying Tong , Chyu-Jiuh Torng , Guangli Liu
- Applicant: Cheng T. Horng , Ru-Ying Tong , Chyu-Jiuh Torng , Guangli Liu
- Applicant Address: US CA Milpitas
- Assignee: MagIC Technologies, Inc.
- Current Assignee: MagIC Technologies, Inc.
- Current Assignee Address: US CA Milpitas
- Agency: Saile Ackerman LLC
- Agent Stephen B. Ackerman
- Main IPC: H01L47/00
- IPC: H01L47/00

Abstract:
A MTJ that minimizes error count (EC) while achieving high MR value, low magnetostriction, and a RA of about 1100 Ω-μm2 for 1 Mbit MRAM devices is disclosed. The MTJ has a composite AP1 pinned layer made of a lower amorphous Co60Fe20B20 layer and an upper crystalline Co75Fe25 layer to promote a smoother and more uniform AlOx tunnel barrier. A “stronger oxidation” state is realized in the AlOx layer by depositing a thicker than normal Al layer or extending the ROX cycle time for Al oxidation and thereby reduces tunneling hot spots. The NiFe free layer has a low Fe content of about 8 to 21 atomic % and the Hf content in the NiFeHf capping layer is from 10 to 25 atomic %. A Ta hard mask is formed on the capping layer. EC (best) is reduced from >100 ppm to
Public/Granted literature
- US20080217710A1 Novel SyAF structure to fabricate Mbit MTJ MRAM Public/Granted day:2008-09-11
Information query
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