Invention Grant
- Patent Title: Transistor for preventing current collapse and having improved leakage current characteristics and method for fabricating the same
- Patent Title (中): 用于防止电流塌陷并具有改善的漏电流特性的晶体管及其制造方法
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Application No.: US11939899Application Date: 2007-11-14
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Publication No.: US07663161B2Publication Date: 2010-02-16
- Inventor: Kazuhiro Kaibara , Masahiro Hikita , Tetsuzo Ueda , Yasuhiro Uemoto , Tsuyoshi Tanaka
- Applicant: Kazuhiro Kaibara , Masahiro Hikita , Tetsuzo Ueda , Yasuhiro Uemoto , Tsuyoshi Tanaka
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-344323 20061221
- Main IPC: H01L31/0328
- IPC: H01L31/0328 ; H01L31/0336 ; H01L31/072 ; H01L31/109 ; H01L29/739 ; H01L29/732 ; H01L29/22 ; H01L33/00 ; H01L29/06

Abstract:
A transistor includes: a first semiconductor layer and a second semiconductor layer with a first region and a second region, which are sequentially formed above a substrate; a first p-type semiconductor layer formed on a region of the second semiconductor layer other than the first and second regions; and a second p-type semiconductor layer formed on the first p-type semiconductor layer. The first p-type semiconductor layer is separated from a drain electrode by interposing therebetween a first groove having a bottom composed of the first region, and from a source electrode by interposing therebetween a second groove having a bottom composed of the second region.
Public/Granted literature
- US20080149965A1 TRANSISTOR AND METHOD FOR FABRICATING THE SAME Public/Granted day:2008-06-26
Information query
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