Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11984738Application Date: 2007-11-21
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Publication No.: US07663187B2Publication Date: 2010-02-16
- Inventor: Takashi Saiki , Hiroyuki Ohta , Hiroyuki Kanata
- Applicant: Takashi Saiki , Hiroyuki Ohta , Hiroyuki Kanata
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Microelectronics Limited
- Current Assignee: Fujitsu Microelectronics Limited
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2003-373499 20031031
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94

Abstract:
An extension region is formed by ion implantation under masking by a gate electrode, and then a substance having a diffusion suppressive function over an impurity contained in a source-and-drain is implanted under masking by the gate electrode and a first sidewall spacer so as to form amorphous layers a semiconductor substrate within a surficial layer thereof and in alignment with the first sidewall spacer, to thereby form an amorphous diffusion suppressive region.
Public/Granted literature
- US20080203475A1 Semiconductor device and method of fabricating the same Public/Granted day:2008-08-28
Information query
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