Invention Grant
- Patent Title: Silicon-on-sapphire semiconductor device with shallow lightly-doped drain
- Patent Title (中): 具有浅掺杂漏极的蓝宝石半导体器件
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Application No.: US11288273Application Date: 2005-11-29
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Publication No.: US07663189B2Publication Date: 2010-02-16
- Inventor: Koichi Fukuda
- Applicant: Koichi Fukuda
- Applicant Address: JP Tokyo
- Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Volentine & Whitt, P.L.L.C.
- Priority: JP2004-367856 20041220
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
A semiconductor device is created in a doped silicon layer at most one-tenth of a micrometer thick formed on and having an interface with a sapphire substrate. An oppositely doped source region is formed in the silicon layer. A gate electrode is formed above part of the silicon layer. A diffusion layer doped with the same type of impurity as the source region but at a lower concentration is formed in the silicon layer, extending into a first area beneath the gate electrode, functioning as a drain region or as a lightly-doped extension of a more heavily doped drain region. The depth of this diffusion layer is less than the thickness of the silicon layer. This comparatively shallow diffusion depth reduces current leakage by inhibiting the formation of a back channel.
Public/Granted literature
- US20060138543A1 Silicon-on-sapphire semiconductor device with shallow lightly-doped drain Public/Granted day:2006-06-29
Information query
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