Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US11407323Application Date: 2006-04-20
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Publication No.: US07663207B2Publication Date: 2010-02-16
- Inventor: Kuniko Kikuta , Masayuki Furumiya , Ryota Yamamoto , Makoto Nakayama
- Applicant: Kuniko Kikuta , Masayuki Furumiya , Ryota Yamamoto , Makoto Nakayama
- Applicant Address: JP Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2005-123462 20050421
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
A semiconductor device includes a capacitor with an MIM structure, by which the dimensional accuracy of the device is improved, and a stable capacitance value is given. The semiconductor device 100 includes: a semiconductor substrate 102; a capacitor forming region 130 in which an MIM capacitor is formed, which has an insulating interlayer 104 formed on the semiconductor substrate 102, a first electrode 110, and a second electrode 112, and the first electrode 110 and the second electrode 112 are arranged facing each other through the insulating interlayer 104; and a shielding region 132 which includes a plurality of shielding electrodes 114 formed in the outer edge of the capacitor forming region 130 and, at the same time, set at a predetermined potential in the same layer as that of the MIM capacitor on the semiconductor substrate 102, and shields the capacitor forming region 130 from other regions.
Public/Granted literature
- US20060237819A1 Semiconductor device Public/Granted day:2006-10-26
Information query
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