Invention Grant
- Patent Title: Semiconductor device package
- Patent Title (中): 半导体器件封装
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Application No.: US11936005Application Date: 2007-11-06
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Publication No.: US07663217B2Publication Date: 2010-02-16
- Inventor: Byung-Jo Kim , Hyung-Lae Eun , Sang-Jib Han
- Applicant: Byung-Jo Kim , Hyung-Lae Eun , Sang-Jib Han
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2006-0112974 20061115
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
Provided is a semiconductor device package. The semiconductor device package includes: stacked semiconductor chips having bonding pads; a PCB (printed circuit board) mounting the stacked semiconductor chips thereon, and including bonding electrodes that correspond to the bonding pads; and interposers respectively covering the stacked semiconductor chips and interposed between the stacked semiconductor chips. The interposers comprise wire patterns connecting the bonding pads with the bonding electrodes, and connecting the interposers to each other.
Public/Granted literature
- US20080111225A1 SEMICONDUCTOR DEVICE PACKAGE Public/Granted day:2008-05-15
Information query
IPC分类:
