Invention Grant
- Patent Title: Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
- Patent Title (中): 封装电路板的引脚数和封装数量减少，包括引脚数量减少的封装电路板及其制造方法
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Application No.: US11028553Application Date: 2005-01-05
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Publication No.: US07663221B2Publication Date: 2010-02-16
- Inventor: Kyung-Lae Jang , Hee-Seok Lee
- Applicant: Kyung-Lae Jang , Hee-Seok Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce
- Priority: KR10-2004-0000908 20040107
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H01L23/52 ; H01L25/07 ; H01L25/18 ; H01L25/065 ; H01L23/48 ; H01L23/495
Abstract:
A package circuit board having a reduced package size. The package circuit board may include a semiconductor substrate in place of a printed circuit board. The package circuit board may further include a microelectronic chip mounted on the semiconductor substrate, the microelectronic chip having at least one of active and passive elements formed on the semiconductor substrate semiconductor substrate.
Public/Granted literature
- US20050146018A1 Package circuit board and package including a package circuit board and method thereof Public/Granted day:2005-07-07
Information query
IPC分类:
