Invention Grant
- Patent Title: Heat-releasing printed circuit board and semiconductor chip package
- Patent Title (中): 散热印刷电路板和半导体芯片封装
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Application No.: US12010643Application Date: 2008-01-28
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Publication No.: US07663226B2Publication Date: 2010-02-16
- Inventor: Seung-Hyun Cho , Seung-Chul Kim , Sang-Soo Lee , Jung-Woo Lee
- Applicant: Seung-Hyun Cho , Seung-Chul Kim , Sang-Soo Lee , Jung-Woo Lee
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0098381 20070928
- Main IPC: H01L23/12
- IPC: H01L23/12 ; H01L23/053
Abstract:
A heat-releasing printed circuit board and semiconductor chip package are disclosed. The heat-releasing printed circuit board includes an insulation layer, on a surface of which a circuit pattern is formed, and a solder resist, which is stacked on the insulation layer, where the solder resist contains carbon nanotubes. The heat-releasing printed circuit board allows the heat generated in a semiconductor chip to be dispersed in several directions of the board or package, to improve heat-releasing property.
Public/Granted literature
- US20090085193A1 Heat-releasing printed circuit board and semiconductor chip package Public/Granted day:2009-04-02
Information query
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