Invention Grant
- Patent Title: Electronic component and electronic component module
- Patent Title (中): 电子元件和电子元件模块
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Application No.: US11727487Application Date: 2007-03-27
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Publication No.: US07663228B2Publication Date: 2010-02-16
- Inventor: Yoshihiro Tateiwa , Kakushi Nakagawa
- Applicant: Yoshihiro Tateiwa , Kakushi Nakagawa
- Applicant Address: JP Yamanashi
- Assignee: Eudyna Devices Inc.
- Current Assignee: Eudyna Devices Inc.
- Current Assignee Address: JP Yamanashi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2006-094033 20060330
- Main IPC: H01L23/043
- IPC: H01L23/043
Abstract:
An electronic component includes an electronic element, a conductive first base portion, a conductive second base portion, an insulator and a terminal. An electronic element is to be mounted on the electronic element mounting portion. The electronic element mounting portion is mounted on the first base portion. The insulator insulates the first base portion from the second base portion and couples the first base portion to the second base portion. The terminal is provided on the first base portion and is insulated from the first base portion.
Public/Granted literature
- US20070228405A1 Electronic component and electronic component module Public/Granted day:2007-10-04
Information query
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