Methods of forming channels on an integrated circuit die and die cooling systems including such channels

Invention Grant

US07663230B2 Methods of forming channels on an integrated circuit die and die cooling systems including such channels 有权

Title translation: 在集成电路管芯上形成通道的方法和包括这种通道的模具冷却系统

Patent Title: Methods of forming channels on an integrated circuit die and die cooling systems including such channels
Patent Title (中): 在集成电路管芯上形成通道的方法和包括这种通道的模具冷却系统
Application No.: US12080682

Application Date: 2008-04-04
Publication No.: US07663230B2

Publication Date: 2010-02-16
Inventor: Shriram Ramanathan , Chin Chang Cheng , Alan M. Myers
Applicant: Shriram Ramanathan , Chin Chang Cheng , Alan M. Myers
Applicant Address: US CA Santa Clara
Assignee: Intel Corporation
Current Assignee: Intel Corporation
Current Assignee Address: US CA Santa Clara
Agent Kenneth A. Nelson
Main IPC: H01L23/34
IPC: H01L23/34

Abstract:

A method of forming channels on a die or other substrate. Also disclosed are liquid cooling systems including such channels.

Abstract(Chinese):

在模具或其他基板上形成通道的方法。还公开了包括这种通道的液体冷却系统。

Public/Granted literature

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/34	.冷却装置；加热装置；通风装置或温度补偿装置