Invention Grant
- Patent Title: Thermal interface material and solder preforms
- Patent Title (中): 热界面材料和焊料预制件
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Application No.: US11682729Application Date: 2007-03-06
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Publication No.: US07663242B2Publication Date: 2010-02-16
- Inventor: Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
- Applicant: Brian G. Lewis , Bawa Singh , John P. Laughlin , David V. Kyaw , Anthony E. Ingham , Attiganal N. Sreeram , Leszek Hozer , Michael J. Liberatore , Gerard R. Minogue
- Agency: Senninger Powers LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
Public/Granted literature
- US20070145546A1 THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS Public/Granted day:2007-06-28
Information query
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