Invention Grant
US07663253B2 Board having electronic parts mounted by using under-fill material and method for producing the same
有权
具有通过使用未填充材料安装的电子部件的板及其制造方法
- Patent Title: Board having electronic parts mounted by using under-fill material and method for producing the same
- Patent Title (中): 具有通过使用未填充材料安装的电子部件的板及其制造方法
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Application No.: US11463169Application Date: 2006-08-08
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Publication No.: US07663253B2Publication Date: 2010-02-16
- Inventor: Yoshihiro Machida
- Applicant: Yoshihiro Machida
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2005-245547 20050826
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
A board 1 according to the present invention includes a board main body 3; electronic parts 5 electrically connected to and mounted on the board main body 3; and an under-fill material 19 with which a part between the board main body 3 and a surface of the electronic parts 5 electrically connected to the board main body is filled. A hole 21 passing through a layer 19a of the under-fill material that flows outside from a connecting area of the electronic parts 5 and the board main body 3 is provided for electrically connecting other parts to the board main body.
Public/Granted literature
- US20070045867A1 BOARD HAVING ELECTRONIC PARTS MOUNTED BY USING UNDER-FILL MATERIAL AND METHOD FOR PRODUCING THE SAME Public/Granted day:2007-03-01
Information query
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