Invention Grant
- Patent Title: Current sensor and molding method thereof
- Patent Title (中): 电流传感器及其成型方法
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Application No.: US12000501Application Date: 2007-12-13
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Publication No.: US07663358B2Publication Date: 2010-02-16
- Inventor: Shinichi Hashio , Shingo Nomoto
- Applicant: Shinichi Hashio , Shingo Nomoto
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Edwards Angell Palmer & Dodge LLP
- Priority: JP2006-342542 20061220
- Main IPC: G01R15/20
- IPC: G01R15/20 ; B29C45/14

Abstract:
A current sensor which can measure accurately current of a wide range, at low cost. A C-shaped shield plate is positioned around a flow direction of a current of the bus bar. When the current flows through the bus bar, magnetic flux density of a magnetic field is generated. A magneto-electronic conversion element detects the magnetic flux density of the magnetic field, and converts the magnetic flux density into an electric signal. Furthermore, the magneto-electronic conversion element is arranged near a position where the previously measured magnetic flux density of the magnetic field, which is generated when a current flows through the bus bar, is minimized between the conductor and the shield plate.
Public/Granted literature
- US20080186021A1 Current sensor and molding method thereof Public/Granted day:2008-08-07
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