Invention Grant
US07663448B2 Laminated balun with an integrally mounted matching circuit
有权
具有整体安装的匹配电路的叠层平衡 - 不平衡变压器
- Patent Title: Laminated balun with an integrally mounted matching circuit
- Patent Title (中): 具有整体安装的匹配电路的叠层平衡 - 不平衡变压器
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Application No.: US11827056Application Date: 2007-07-10
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Publication No.: US07663448B2Publication Date: 2010-02-16
- Inventor: Nobuhiro Harada , Atsushi Okabe , Morito Yasumura
- Applicant: Nobuhiro Harada , Atsushi Okabe , Morito Yasumura
- Applicant Address: JP Yamaguchi
- Assignee: UBE Industries, Ltd.
- Current Assignee: UBE Industries, Ltd.
- Current Assignee Address: JP Yamaguchi
- Agency: Frommer Lawrence & Haug LLP
- Agent Ronald R. Santucci
- Priority: JP2006-194103 20060714
- Main IPC: H03H5/00
- IPC: H03H5/00 ; H03H7/38

Abstract:
A dielectric member comprising a laminated balun and a matching circuit, wherein the matching circuit is integrally mounted within the laminated balun. The matching circuit comprises a patterned conductive film formed on a surface of an existing dielectric substrate in the balun such that the balun is not increased in size.
Public/Granted literature
- US20080012780A1 Laminated balun Public/Granted day:2008-01-17
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