Invention Grant
- Patent Title: Heat dissipating assembly having a fan duct
- Patent Title (中): 具有风扇导管的散热组件
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Application No.: US11959272Application Date: 2007-12-18
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Publication No.: US07663882B2Publication Date: 2010-02-16
- Inventor: Hao Li , Tao Li , Jun Zhang
- Applicant: Hao Li , Tao Li , Jun Zhang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A heat dissipating assembly for dissipating heat from a graphic card and a hard disk driver (30), includes a heat sink (10) for contacting the graphic card and a fan duct (20) fixed on the heat sink. The fan duct is made by bending a planar metal plate and has a first portion soldered to a top face of the heat sink and a second portion slantwise and upwardly extending from the first portion. When a fan (40) generates an airflow towards the heat sink, a part of the airflow flows through the heat sink to remove heat in the heat sink, and another part of the airflow is guided slantwise and upwardly by the second portion of the fan duct to flow through the hard disk driver, thereby to cool the hard driver.
Public/Granted literature
- US20090154099A1 HEAT DISSIPATING ASSEMBLY HAVING A FAN DUCT Public/Granted day:2009-06-18
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