Invention Grant
- Patent Title: Electric circuit device and the manufacturing method
- Patent Title (中): 电路装置及其制造方法
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Application No.: US12003037Application Date: 2007-12-19
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Publication No.: US07663886B2Publication Date: 2010-02-16
- Inventor: Kazuo Aoki , Junji Tsuruoka , Seiji Yasui , Yasushi Kabata , Shin Soyano
- Applicant: Kazuo Aoki , Junji Tsuruoka , Seiji Yasui , Yasushi Kabata , Shin Soyano
- Applicant Address: JP Anjo JP Tokyo
- Assignee: Aisin AW Co., Ltd.,Fuji Electric Device Technology Co., Ltd.
- Current Assignee: Aisin AW Co., Ltd.,Fuji Electric Device Technology Co., Ltd.
- Current Assignee Address: JP Anjo JP Tokyo
- Agency: Oliff & Berridge, PLC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/02

Abstract:
An electronic circuit device includes a lower-side substrate formed with a main circuit; an upper-side substrate formed with a drive control circuit that drivingly controls the main circuit; a support body positionally fixed above the lower-side substrate with resin in a hardened state; and a case having a peripheral portion with an outer surface that has at least a portion of an external lead-out terminal of the drive control circuit and the main circuit thereon, and a substrate storage space that accommodates the lower-side substrate on a side inward from the peripheral portion.
Public/Granted literature
- US20080158824A1 Electric circuit device and the manufacturing method Public/Granted day:2008-07-03
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