Invention Grant
- Patent Title: Printed circuit board thickness adaptors
- Patent Title (中): 印刷电路板厚度适配器
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Application No.: US11487506Application Date: 2006-07-17
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Publication No.: US07663888B2Publication Date: 2010-02-16
- Inventor: Simon Paul Creasy , Paul James Brown , Fabien Letourneau
- Applicant: Simon Paul Creasy , Paul James Brown , Fabien Letourneau
- Applicant Address: FR Paris
- Assignee: Alcatel Lucent
- Current Assignee: Alcatel Lucent
- Current Assignee Address: FR Paris
- Agency: Kramer & Amado, P.C.
- Main IPC: H05K1/14
- IPC: H05K1/14

Abstract:
A printed circuit board card comprising: a printed circuit board having a first thickness and having first and second edges for inserting into respective channels of card guides, the channels of the card guides for receiving printed circuit boards having a second thickness, the second thickness being greater than the first thickness; and, first and second thickness adaptors each having a third thickness applied at the first and second edges, respectively, a sum of the first and third thicknesses approximating the second thickness, to thereby align the printed circuit board in the channels of the card guides.
Public/Granted literature
- US20080013290A1 Printed circuit board thickness adaptors Public/Granted day:2008-01-17
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