Invention Grant
- Patent Title: Sensor node and circuit board arrangement
- Patent Title (中): 传感器节点和电路板布置
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Application No.: US11976041Application Date: 2007-10-19
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Publication No.: US07663893B2Publication Date: 2010-02-16
- Inventor: Shunzo Yamashita
- Applicant: Shunzo Yamashita
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Stites & Harbison PLLC
- Agent Juan Carlos A. Marquez, Esq.
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
An electronic circuit, preferable as a sensor node, has a highly sensitive radio function and is capable of performing a low-power-consumption operation. The electronic device has a board; a connector for connecting a sensor; a first signal processor circuit receiving an input of sensor data from the sensor through the connector and forming transmission data; and a second signal processor circuit converting a transmission signal from the first signal processor circuit into a high-frequency signal. The connector and the first signal processor circuit are mounted on a first surface of the board, and the second signal processor circuit is mounted on a second surface of the board.
Public/Granted literature
- US20080130253A1 Sensor node and circuit board arrangement Public/Granted day:2008-06-05
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