Invention Grant
- Patent Title: Microphone array in housing
- Patent Title (中): 麦克风阵列在外壳
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Application No.: US11771006Application Date: 2007-06-29
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Publication No.: US07664284B2Publication Date: 2010-02-16
- Inventor: Ming Zhang , Lili Chen , Bo Zhang
- Applicant: Ming Zhang , Lili Chen , Bo Zhang
- Applicant Address: US CA Cupertino
- Assignee: Fortemedia, Inc.
- Current Assignee: Fortemedia, Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
An electronic device includes a circuit board, a first microphone module, and a second microphone module. The first microphone module includes a first omnidirectional microphone connected to the circuit board, a first boot also connected to the circuit board, and a first tube extending from the first boot. The second microphone module includes a second omnidirectional microphone connected to the circuit board, a second boot also connected to the circuit board, and a second tube extending from the second boot. The first and second omnidirectional microphones are identical, and the first and second boots are identical.
Public/Granted literature
- US20080069389A1 MICROPHONE ARRAY IN HOUSING Public/Granted day:2008-03-20
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