Invention Grant
- Patent Title: Semiconductor device layout method and layout program
- Patent Title (中): 半导体器件布局方法和布局方案
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Application No.: US11892533Application Date: 2007-08-23
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Publication No.: US07665053B2Publication Date: 2010-02-16
- Inventor: Hiroyuki Tsujimoto
- Applicant: Hiroyuki Tsujimoto
- Applicant Address: JP Tokyo
- Assignee: Fujitsu Microelectronics Limited
- Current Assignee: Fujitsu Microelectronics Limited
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2006-230462 20060828
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
It is an aspect of the embodiments discussed herein to provide a semiconductor device layout method and a semiconductor device layout program that enable the minimum necessary decoupling capacitances to be placed efficiently according to a circuit configuration, placement positions, operation timings, and clock tree of functional circuits.
Public/Granted literature
- US20080052657A1 Semiconductor device layout method and layout program Public/Granted day:2008-02-28
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