A method for manufacturing electronic modules from a moulded module strip having a laminate including at least one conductive layer, and one or more dies and or surface mounted devices arranged on an upper surface of the laminate and embedded by a moulding compound, includes the steps of: cutting partway through the laminate reaching at least through the uppermost of the at least one conductive layers and thereby creating a cut of width in the laminate; applying a conductive coating covering the upper surface of the laminate, and further covering all surfaces of the cut, the conductive coating contacting the uppermost conductive layer in the laminate; singulating the moulded module strip into separate electronic modules by cutting all the way through the laminate by creating a second cut in said first cut, the second cut having a width d smaller than the width of the first cut.