Invention Grant
- Patent Title: Method of manufacturing a laminated leadframe
- Patent Title (中): 层叠引线框架的制造方法
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Application No.: US11595757Application Date: 2006-11-09
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Publication No.: US07665205B2Publication Date: 2010-02-23
- Inventor: Kiyoshi Matsunaga , Chikaya Mimura , Takao Shioyama
- Applicant: Kiyoshi Matsunaga , Chikaya Mimura , Takao Shioyama
- Applicant Address: JP
- Assignee: Mitsui High-Tec, Inc.
- Current Assignee: Mitsui High-Tec, Inc.
- Current Assignee Address: JP
- Agency: Wood, Phillips, Katz, Clark & Mortimer
- Priority: JP2005-327631 20051111; JP2005-331937 20051116
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H01L21/00
Abstract:
Disclosed are a method for manufacturing a laminated lead frame and a laminated lead frame manufactured thereby, wherein lead frame single plates to be laminated one on top of the other can be reliably bonded together with a relatively light load. Under the method for manufacturing a laminated lead frame by means of stacking and bonding lead frame single plates 10 and 11, each of which has been processed into a predetermined shape, a plurality of protuberance sections 12 are formed in at least one of mutually-opposing surfaces of the lead frame single plates 10 and 11 that vertically pair up with each other. The mutually-opposing lead frame single plates 11, 12 are bonded together via the protuberance sections 12.
Public/Granted literature
- US20070119050A1 Method of manufacturing laminated lead frame and lead frame produced by the method Public/Granted day:2007-05-31
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