Invention Grant
- Patent Title: Machine for making packaging with form-fit connection
- Patent Title (中): 用于与包装形式配合的机器
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Application No.: US11181037Application Date: 2005-07-13
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Publication No.: US07665281B2Publication Date: 2010-02-23
- Inventor: Dietmar Send , Peter Riegger , Joachim Wokurka
- Applicant: Dietmar Send , Peter Riegger , Joachim Wokurka
- Applicant Address: DE Biedenkopf-Wallau
- Assignee: CFS Germany GmbH
- Current Assignee: CFS Germany GmbH
- Current Assignee Address: DE Biedenkopf-Wallau
- Agency: Dobrusin & Thennisch PC
- Main IPC: B65B7/28
- IPC: B65B7/28 ; B65B47/00
Abstract:
The present invention relates to a packaging with a packaging tray, into which a product for packing can be filled and which is closed with a lid, whereby at least one form-fit connection connects the packaging tray with the lid and the connection includes first and second connection elements. Furthermore, the present invention relates to a method for the production of a packaging as well as a packaging machine.
Public/Granted literature
- US20070012708A1 Packaging with a subsequently moulded form-fit connection Public/Granted day:2007-01-18
Information query
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