Invention Grant
- Patent Title: Method and apparatus for measuring shape of heat treatment jig
- Patent Title (中): 用于测量热处理夹具形状的方法和装置
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Application No.: US12020974Application Date: 2008-01-28
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Publication No.: US07665367B2Publication Date: 2010-02-23
- Inventor: Hitoshi Mishiro , Atsushi Nakamura
- Applicant: Hitoshi Mishiro , Atsushi Nakamura
- Applicant Address: JP Tokyo
- Assignee: Asahi Glass Company, Limited
- Current Assignee: Asahi Glass Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-018393 20070129
- Main IPC: G01N3/00
- IPC: G01N3/00
Abstract:
A method for measuring the shape of a heating treatment jig to be held by a holding portion of a vertical heat treatment apparatus includes measuring the shape of the heat treatment jig in a state that the position of a supporting portion for supporting the heat treatment jig is set to be the same as the position of the holding portion for the heat treatment jig in the vertical heat treatment apparatus. The heat treatment jig can be used for placing a semiconductor wafer to be subjected to heat treatment.
Public/Granted literature
- US20080178685A1 METHOD AND APPARATUS FOR MEASURING SHAPE OF HEAT TREATMENT JIG Public/Granted day:2008-07-31
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