Invention Grant
- Patent Title: Laminate-type gasket
- Patent Title (中): 层压垫片
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Application No.: US12068911Application Date: 2008-02-13
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Publication No.: US07665741B2Publication Date: 2010-02-23
- Inventor: Toshihiro Imai
- Applicant: Toshihiro Imai
- Applicant Address: JP Tokyo
- Assignee: Ishikawa Gasket Co., Ltd.
- Current Assignee: Ishikawa Gasket Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agent Manabu Kanesaka
- Priority: JP2007-036436 20070216
- Main IPC: F02F11/00
- IPC: F02F11/00

Abstract:
A metal laminate gasket includes a first metal substrate having a base portion and a folded portion, a second metal substrate laminated with the first metal plate, an intermediate plate disposed between the base portion and the second metal substrate, and a bead plate situated under the base portion. The bead plate includes a first full bead disposed around the first hole to project toward the base portion, and an outside portion disposed above the intermediate plate. The bead plate, first and second metal substrates and intermediate plate have first and second holes. The bead plate is formed to surround the first and second holes without extending to an entire area of the gasket. The total plate thickness of the first and second metal substrates, bead plate and intermediate plate at the full bead position is substantially same as that around the second hole.
Public/Granted literature
- US20080197579A1 Laminate-type gasket Public/Granted day:2008-08-21
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