Invention Grant
- Patent Title: Platen-linkage assembly of injection molding system
- Patent Title (中): 注塑系统的压板连接组件
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Application No.: US11956365Application Date: 2007-12-14
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Publication No.: US07665984B2Publication Date: 2010-02-23
- Inventor: Alex Teng
- Applicant: Alex Teng
- Applicant Address: CA Bolton, ON
- Assignee: Husky Injection Molding Systems Ltd.
- Current Assignee: Husky Injection Molding Systems Ltd.
- Current Assignee Address: CA Bolton, ON
- Agency: Husky Intellectual Property Services
- Main IPC: B29C45/64
- IPC: B29C45/64
Abstract:
Disclosed is a platen-linkage assembly, including: (i) a pair of supports being movably guidable along a respective one of a pair of linear-guide rails, (ii) mold-carrier sections being configured to support a mold stack; and (iii) a pair of primary links being rotatably coupled with and being positioned between a chosen one of: (i) the mold-carrier sections, and (ii) the pair of supports.
Public/Granted literature
- US20090155406A1 Platen-Linkage Assembly of Injection Molding System Public/Granted day:2009-06-18
Information query
