Invention Grant
- Patent Title: Circuit connection structure and printed circuit board
- Patent Title (中): 电路连接结构和印刷电路板
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Application No.: US11564332Application Date: 2006-11-29
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Publication No.: US07666001B2Publication Date: 2010-02-23
- Inventor: Shinichi Nishimura
- Applicant: Shinichi Nishimura
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2005-343050 20051129
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
To prevent damage to equipment due to the oblique insertion of a fat cable, a capacitor-connection line having a capacitive circuit element is disposed adjacent to a power supply line of a printed circuit board and connected to a ground of the printed circuit board. When a flat cable is obliquely inserted, the capacitor-connection line which comes into erroneous contact with the power supply line works as high impedance in the case of a direct current, and the current does not flow. Damage generated when a flat cable is obliquely inserted into a connector of a printed circuit board is prevented in this manner.
Public/Granted literature
- US20070123074A1 CIRCUIT CONNECTION STRUCTURE AND PRINTED CIRCUIT BOARD Public/Granted day:2007-05-31
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