Invention Grant
US07666014B2 High density connector assembly having two-leveled contact interface
失效
高密度连接器组件,具有两层触点接口
- Patent Title: High density connector assembly having two-leveled contact interface
- Patent Title (中): 高密度连接器组件,具有两层触点接口
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Application No.: US12157112Application Date: 2008-06-06
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Publication No.: US07666014B2Publication Date: 2010-02-23
- Inventor: Chong Yi , Kuan-Yu Chen
- Applicant: Chong Yi , Kuan-Yu Chen
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Ming Chieh Chang; Wei Te Chung; Andrew C. Cheng
- Main IPC: H01R13/64
- IPC: H01R13/64

Abstract:
A connector assembly (100) includes a first connector (10) and a mating second connector (30). Each connector includes a number of leadframes (21, 41) stacked one by one. Each leadframe has a first leadframe housing (211, 411) and a second leadframe housing (214, 414) attached to the first leadframe housing. Each connector includes an array of first terminals (5) and an array of second terminals (6) respectively mounted along the second and the first leadframe housings, and a pair of latching members (25, 45) mounted at opposite sides of the leadframes together with the first and second terminals to tie the plurality of stacked leadframes as a whole.
Public/Granted literature
- US20090264001A1 High density connector assembly having two-leveled contact interface Public/Granted day:2009-10-22
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