Invention Grant
- Patent Title: Lock modular graft component junctions
- Patent Title (中): 锁定模块化移植物组件接头
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Application No.: US10222728Application Date: 2002-08-16
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Publication No.: US07666221B2Publication Date: 2010-02-23
- Inventor: Arnold M. Escano
- Applicant: Arnold M. Escano
- Applicant Address: US CA Menlo Park
- Assignee: Endovascular Technologies, Inc.
- Current Assignee: Endovascular Technologies, Inc.
- Current Assignee Address: US CA Menlo Park
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: A61F2/06
- IPC: A61F2/06 ; A61M29/00
Abstract:
The present invention embodies an endovascular graft having an attachment frame connection mechanism that allows placement of the main body component in vasculature in combination with limb components. Various limb component-to-main body component attachment mechanisms are provided which ensure a reliable bond while facilitating a smaller delivery profile.
Public/Granted literature
- US20030229389A1 Lock modular graft component junctions Public/Granted day:2003-12-11
Information query
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