Invention Grant
- Patent Title: High modulus polyamide fibers
- Patent Title (中): 高模量聚酰胺纤维
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Application No.: US11528701Application Date: 2006-09-27
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Publication No.: US07666499B2Publication Date: 2010-02-23
- Inventor: Dongwook Jung , Richard Kotek , Alan E. Tonelli , Nadarajah Vasanthan
- Applicant: Dongwook Jung , Richard Kotek , Alan E. Tonelli , Nadarajah Vasanthan
- Applicant Address: US NC Raleigh
- Assignee: North Carolina State University
- Current Assignee: North Carolina State University
- Current Assignee Address: US NC Raleigh
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Main IPC: D02G3/00
- IPC: D02G3/00

Abstract:
A process for preparing high initial modulus and high tensile strength polyamide fibers is described. The process comprises complexing the polyamide with a Lewis acid, dry-jet wet spinning the complexed fibers, drying the spun fibers for a period of time, drawing the fibers, and soaking the fibers in solvent to remove the Lewis acid. High molecular weight nylon 6,6 fibers prepared according to the described process show initial moduli of up to 30.1 GPa and tenacities of up to 2.5 GPa.
Public/Granted literature
- US20070210482A1 High modulus polyamide fibers Public/Granted day:2007-09-13
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