Invention Grant
US07666569B2 Positive resist composition and method for forming resist pattern
有权
正型抗蚀剂组合物和形成抗蚀剂图案的方法
- Patent Title: Positive resist composition and method for forming resist pattern
- Patent Title (中): 正型抗蚀剂组合物和形成抗蚀剂图案的方法
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Application No.: US10540056Application Date: 2003-12-18
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Publication No.: US07666569B2Publication Date: 2010-02-23
- Inventor: Kazufumi Sato , Mitsuo Hagihara , Daisuke Kawana
- Applicant: Kazufumi Sato , Mitsuo Hagihara , Daisuke Kawana
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2002-376294 20021226
- International Application: PCT/JP03/16266 WO 20031218
- International Announcement: WO2004/059392 WO 20040715
- Main IPC: G03F7/004
- IPC: G03F7/004

Abstract:
A positive resist composition including a resin component (A) containing an acid dissociable dissolution inhibiting group whose alkali solubility increases under action of acid and an acid generator component (B) that generates acid on exposure, wherein the resin component (A) is a copolymer comprising a first structural unit (a1) derived from a hydroxystyrene and a second structural unit (a2) derived from a (meth)acrylate ester containing an alcoholic hydroxyl group, in which 10 mol % or more and 25 mol % or less of a combined total of hydroxyl groups within the structural units (a1) and alcoholic hydroxyl groups within the structural units (a2) are protected with the acid dissociable dissolution inhibiting groups, and a weight average molecular weight of the copolymer prior to protection with the acid dissociable dissolution inhibiting groups is 2,000 or more and 8,500 or less.
Public/Granted literature
- US20060251986A1 Positive resist composition and method for forming resist pattern Public/Granted day:2006-11-09
Information query
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