Invention Grant
- Patent Title: Resist top coat composition and patterning process
- Patent Title (中): 抵抗面漆组合和图案化工艺
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Application No.: US11808543Application Date: 2007-06-11
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Publication No.: US07666572B2Publication Date: 2010-02-23
- Inventor: Yuji Harada , Jun Hatakeyama
- Applicant: Yuji Harada , Jun Hatakeyama
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-176947 20060627
- Main IPC: G03F7/09
- IPC: G03F7/09 ; G03F7/20 ; G03F7/30 ; G03C1/76

Abstract:
There is disclosed a resist top coat composition, comprising at least a polymer that has an amino group or a sulfonamide group at a polymer end and that is represented by the following general formula (1); and a patterning process comprising: at least, a step of forming a photoresist film on a substrate; a step of forming a resist top coat on the photoresist film by using the resist top coat composition; a step of exposing the substrate; and a step of developing the substrate with a developer. There can be provided a resist top coat composition that makes it possible to provide more certainly rectangular and excellent resist patterns when a top coat is formed on a photoresist film; and a patterning process using such a composition.
Public/Granted literature
- US20070298355A1 Resist top coat composition and patterning process Public/Granted day:2007-12-27
Information query
IPC分类: