A positive photosensitive resin composition containing 100 parts by weight of a polyimide precursor (A) having a constituent unit represented by the formula (1), 15 to 25 parts by weight of a crosslinking agent (B) represented by the formula (2), and 2 to 5 parts by weight of a photosensitizer (C) generating acid upon irradiation of an actinic ray: wherein m is an integer of 1 or greater, and R is an aromatic group or an aliphatic group having a valency of 1 or higher. The positive photosensitive resin composition can be developed by using an aqueous solution of alkali metal carbonate, is capable of forming micropatterns, and has excellent thermal resistance and the like. A method for forming a positive pattern, and uses thereof are also provided.