Invention Grant
- Patent Title: Positive resist composition and pattern forming method
- Patent Title (中): 正抗蚀剂组成和图案形成方法
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Application No.: US12058327Application Date: 2008-03-28
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Publication No.: US07666574B2Publication Date: 2010-02-23
- Inventor: Toshiaki Fukuhara , Shinichi Kanna , Hiromi Kanda
- Applicant: Toshiaki Fukuhara , Shinichi Kanna , Hiromi Kanda
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-085988 20070328; JP2008-076600 20080324
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/30
Abstract:
A positive photosensitive composition comprises (A) a resin that has an acid decomposable repeating unit represented by formula (I) and increases its solubility in an alkali developer by action of an acid; (B) a compound generating an acid in irradiation with actinic light or radiation; (C) a resin that contains neither fluorine nor silicon and has a repeating unit having the predetermined structure; and (D) a solvent, wherein each symbol represents a predetermined group.
Public/Granted literature
- US20080241746A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD Public/Granted day:2008-10-02
Information query
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