Invention Grant
- Patent Title: Method of manufacturing a coil inductor
- Patent Title (中): 制造线圈电感器的方法
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Application No.: US12019688Application Date: 2008-01-25
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Publication No.: US07666688B2Publication Date: 2010-02-23
- Inventor: Kai-Ming Ching , Chen-Shien Chen
- Applicant: Kai-Ming Ching , Chen-Shien Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Thomas, Kayden, Horstmeyer & Risley
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A method of manufacturing a coil inductor and a coil inductor are provided. A plurality of conductive bottom structures are formed to be lying on a first dielectric layer. A plurality pairs of conductive side structures are then formed, wherein each pair of the conductive side structure stand on top surface of a first end and a second end of each conductive bottom structure respectively; a second dielectric layer is formed on the first dielectric layer, coating the bottom and side structures; and a plurality of conductive top structures are formed to be lying on the second dielectric layer, wherein each conductive top structure electrically connects each pair of the conductive side structures, wherein the conductive bottom structures, the conductive side structures and the conductive top structures together form a conductive coil structure.
Public/Granted literature
- US20090188104A1 Method of Manufacturing a Coil Inductor Public/Granted day:2009-07-30
Information query
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